Thermal
management
solutions
Development & Manufacture
Thermal Pad Series
Thermal Paste Series
Thermal Gel Series
THE IMPORTANCE
OF TIMS
TIMs play a crucial role in heat dissipation systems. Almost all high-power electronic devices rely on TIMs to effectively transfer heat from the heat source to the heat sink. It’s the “Small but Critical Thermal Bridge.”
Reduce Thermal
Contact Resistance
Preventing Hot Spot
Provides cushioning and
surface adaptability
Flexible system design
Multi applications of thermal management
# CPUs
# GPUs
# AI Servers
# Graphics Cards
# LED Lighting
# Optoelectronics
# Automotive
electronics
# Power batteries
# Charging stations
# Power modules
# Thermal modules
# Communication
equipment
applications
Key Factors of Heat Dissipation System
The trends of future electronic product development is "higher power density, higher integration, higher bandwidth, and lower energy consumption“.
Lower "total interfacial thermal resistance" rather than just pursuing a higher K-value.
In the future, TIM will develop towards ultra-thin and ultra-low interface thermal resistance.
TIM needs to be highly adaptable with the of liquid cooling systems.
Key Factors of Heat Dissipation System
Thermal conductivity ( K-value) is insufficient to fully reflect actual heat transfer efficiency. The Interface Contact Thermal Resistance is the key factor.