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OUR TIMS
PRODUCT
It is easy to process into various shapes, making it particularly suitable for heat dissipation in compact equipment and for processing applications on fast automated production lines.
Thermal Pad Series
Carrier Layer
Thickness
Working Temperature
Flame Retardant Grade
Holding Power 1kg @80 ℃
90˚Peeling Strength @Aluminum
Dielectric Breakdown Voltage (AC)
Dielectric Breakdown Voltage (DC)
Thermal Impedance @ 30psi
Thermal Paste Series
It fills the uneven gaps between the heat source and the heat sink, quickly carrying the heat generated by electronic components away from the heat sink, achieving cooling and heat dissipation effects.
Specific Gravity
Viscosity @ 25 ℃
Consistency
Volatile Content 240 hrs @ 100 ℃
Oil Separation 240 hrs @ 150 ℃
Dielectric Strength
Thermal Impedance @ 30psi
Thermal Gel Series
Thermal gel is particularly suitable for potting various electronic components that require high thermal conductivity. It possesses superior physical properties, electrical performance, and thermal stability. It also suitable for large-area heat dissipation applications.
Curing Condition
Apperance
Chemical Type
Viscosity @ 25 ℃
Hardness
Flame Retardant Grade
Dielectric Breakdown Voltage
Thermal Impedance @ 30psi
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